Ultrasonic Methods for Nondestructived Evaluation (NDE)

Joseph TurnerJoseph Turner portrait

CNDE Assoc. Director
Kirby Gray (Battelle) Chair in Engineering
Professor
turner25@iastate.edu
(515) 294-2377

Academic Department Profile

Comprehensive Models of Ultrasound Interactions with Material Microstructure

  • Scattering models based on digital synthetics from DREAM.3D and other software
  • Analytical models that include all levels of multiple scattering
  • Models of scattering from microtexture regions (MTRs)

Experimental Ultrasonics

  • Aerospace applications for Ti64 and other alloys
  • Railroad applications for bearings, wheels, and rail
  • Metal additive manufacturing including in situ and ex situ measurements

Microstructure Characterization

  • Characterization of grain size, grain elongation, grain size distribution
  • Role of microstructure for model assisted probability of detection (MAPOD)
  • Statistics associated with defect detection

Resonant Ultrasound Spectroscopy (RUS) for Hybrid Metal Additive Manufacturing (AM)

  • Quantification of residual stress in peened layers within metal AM samples
  • Computational models for RUS analysis
  • Machining learning for analysis of RUS data

 

Keywords

  • Ultrasonic scattering; Microstructure characterization; Complex microstructures; Metal AM inspection and characterization

Recognitions, Awards & Student Supervision

  • Fellow, Acoustical Society of America (ASA)
  • Fellow, American Society for Nondestructive Testing (ASNT)
  • Bessel Prize from the Alexander von Humboldt Foundation
  • Supervised 25 PhD and 29 MS students to completion

Funded Research Sponsors

  • NSF, NRC, USDoT, DoE, AFRL, FRA, Army, AFOSR, NIH & others
  • Amsted Rail, Rolls Royce, Boeing, Arcelor Mittal, and others
  • Multiple DoD-Sponsored SBIR and STTR Phase I & II (Air Force, NAVAIR, and NAVSEA)

 

Top left - Digital synthetics of polycrystals for ultrsonic models Top right - maps of ultrsonic attenuation for metal AM Bottome left - RUS models and experiements for sample characterization Bottom right - Ultrasonic backscatter modeling and measurements